JPH0289844U - - Google Patents
Info
- Publication number
- JPH0289844U JPH0289844U JP17053688U JP17053688U JPH0289844U JP H0289844 U JPH0289844 U JP H0289844U JP 17053688 U JP17053688 U JP 17053688U JP 17053688 U JP17053688 U JP 17053688U JP H0289844 U JPH0289844 U JP H0289844U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- heat dissipation
- package
- dissipation fin
- lead terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17053688U JPH0289844U (en]) | 1988-12-27 | 1988-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17053688U JPH0289844U (en]) | 1988-12-27 | 1988-12-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0289844U true JPH0289844U (en]) | 1990-07-17 |
Family
ID=31461571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17053688U Pending JPH0289844U (en]) | 1988-12-27 | 1988-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0289844U (en]) |
-
1988
- 1988-12-27 JP JP17053688U patent/JPH0289844U/ja active Pending